Shenzhen Hong Yun Lai Electronic Technology Co. Ltd.

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1. Aluminum substrate copper clad

2. glass fiber board FR-4 production equipment

1.surface treatment :OSP,Shen tin,Shen silver,Lead-free,spray tin,nickel gold plating.
2.layer:2-16
3.width of smallest wire:0.076mm
4.minimum spacing wire:0.076mm
5.minimum line to disk.disk to disk space:0.076mm
6.minimum diameter of ...

3. Echnical support aluminum pcb

Echnical Support aluminum pcb

1.Surface treatment.Osp,Shen Jin,Shen tin,Shen silver,lead-free,spray tin,nickel gold plating.
2.layers:1-4
3.width of smallest wire:0.1mm
4.Minimum spacing wire:0.1mm
5.minimum line to disk.disk to disk ...

4. glass fiber board FR-4 production equipment

5. Echnical support aluminum pcb

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