UV Laser Drilling Machine JG22
Laser Drilling Machine
Usage
The machine is used to drilling via of FPC flexible printed circuit board, and cover layer cutting , FPC flexible printed circuit board cutting, RF rigid-flexible circuit board cutting.
Feature
1.Precision: Using linear motor, high resolution raster ruler, higher shrinkage compensation and advanced image processing technology, fully guaranteed drilling, cutting accuracy and quality.
2.High quality: Roundness is good and clean. The top and bottom diameter of hole are consistent. The min via hole diameter is 50um.
3.Highly intelligent, efficient: Auto-focus, auto-calibrate, auto-position, auto loading and unloading material by RTR.
Parametres
Specification of UV Laser Drilling Machine (ASIDA JG22)
MODEL ASIDA JG22
System Processing Accuracy ( ZHENGYE Conditions) ±25μm
Drilling Speed (ZHENGYE Conditions) 150 hole per second
Roundness ≥90%
Differences Between Up and Down Hole Diameter ≤12.5μm
Objects Maximum Processing Size 540mmX650mm
Processing Capacity Via hoe drilling, PTH cutting
Minimum Processing Hole Diameter 75μm
Laser Wavelength 355 nm
Pressured Air >0.6MPa;500L per minute
Exhaust 30KPa,8.6CMM
Power Supply Single phase, 220V,50Hz, 2.5KW
Dimensions (L×W×H) 1610mmx1660mmx1901mm
