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Helios New Materials Limited

 
 
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Sapphire wafer 2 inch DSP/SSP C-plane/ R-plane/ M-plane/ A-plane 

  Category : Information Technology->Others->IC semiconductor crystal processing

     
Sapphire wafer 2 inch DSP/SSP C-plane/ R-plane/ M-plane/ A-plane
 
 
       

  Product Specification
 
  Model No:      SP-02
  Country  CN
  Brand  helios
  Materials  sapphire
  Size  50.8  millimeters  
  Packing  Class 100 Clean room cleaning and vacuum nitrogen packaging
  Minimum Order  25
  Payment Term  T/T

 

    Product Detail
  Sapphire wafer used as LED substrates and optical windows.

C-plane (polar surface) sapphire substrate is widely used in LED chips industry, because it's easy to grow and process. Due to the lattice mismatch stress caused by internal polarization field trapped carrier, the internal quantum efficiency of C-plane substrate is low.

Using the A-plane (non-polar) and M-plane (semi-polar) substrates significantly reduce the defect density, can be used as back light source of displayer and mobile phone, also can be used for green light LED, Laser and GaN based solar cells.

Specification

Material not less than 99.999%, High Purity, Al2O3

Orientation
C-axis (0001)
M-axis (1010)
R-axis (1102)
A-axis (1120)

Diameter 50.8 +/- 0.1mm

Thickness
400 +/- 25um
430 +/- 25um

Primary Flat Orientation A-Plane +/- 0.1 degree

Surface roughness
Front Side: Epi Polished, Ra less than 0.2nm
Back Side: Epi Polished, Ra less than 0.2nm (SSP)
Fine ground Ra 0.8-1.2um (DSP)

TTV less than 10 um
BOW less than 10 um
Warp less than 10 um

Class 100 Clean room cleaning and vacuum nitrogen packaging.
25 pcs in each cassette.

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