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Shenzhen Teng Phil Technology Co., Ltd.

 
 
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wafer 

  Category : Electronic and electrical->Electronic Parts->connectors

     
wafer
 
 
       

  Product Specification
 
  Model No:      4.2-0.5MM Pitch
  Country  CN
  Brand  TPHIL
  Materials  Copper plated gold
  Size  4.2-1.0Spacing  millimeters  
  Weight  0.5G
  Color  Black white blue can be customized a variety of colors
  Packing  Tape and reel packaging
  Minimum Order  2000
  Payment Term  Cash

 

    Product Detail
  Mechanical:
Insulator Material: High Temperature Thermoplastic (UL94V-0 rated)
Contact: Copper alloy
Insertion Force: 39.2N Max
Withdraw Force: 9.8N Min
Durability mating cycle: 10,000 cycles min.

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