InP wafer,InP substrates,Indium Phosphide->trade

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InP wafer,InP substrates,Indium Phosphide

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InP wafer,InP substrates,Indium Phosphide

Product Specification

Country	CN
Materials	Semiconductor

Product Detail

Indium phosphide can be supplied as ingot sections or as-cut, etched or polished wafers.

Growth Method: LEC
Dopant: undoped,S,Fe,Zn.
Type: N , SI or P
Orientation:(100),(111),(110)
Diameter: 2inch 3inch
Thickness: 350-625um
Surface Treatment: SSP or DSP

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