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1.    4 L,Buried Vias OSP

4 L,Buried Vias OSP

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4 layers Buried Vias and Au Plating,OSP
2.    5 L,immersion Ni/Au

5 L,immersion Ni/Au

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5 layers Flexible, Cu, PI and ADH, immersion Ni/Au
3.    10 L,Flash gold finger

10 L,Flash gold finger

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10 layers , FR4, Flash and gold finger, Impedance control.
4.    6 L, Gold plating

6 L, Gold plating

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6 layers FR4, Gold plating, blue solder mask
5.    8 layers ,FR4, immersion gold, Thickness,4mm

8 layers ,FR4, immersion gold, Thickness,4mm

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8 layers board
Basic Material: FR-4
Board Ply (thickness): 4.0mm
Measurement: 254mm*304.8mm
Conductor Width: 5mil (0.13mm)
Conductor Spacing: 5mil (0.13mm)
SurfaceTreatment: Immersion gold
File Format: Gerber File (RS274X)
Through Hole: ...

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