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Shenzhen Sun&Lynn Circuits Co., Ltd

 
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1.    8-layer PCB with Blind/Buried VIAs

8-layer PCB with Blind/Buried VIAs

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8-layer PCB
8-layer PCB with Blind/Buried VIAs, Unsymmetrical Laminated Stackup Technique
Key Specifications/Special Features:

Red color LPI solder mask
Minimum blind/buried VIAs hole size: 10 mil
Board thickness: 40mil
Surface finish: ...
2.    Blue Color Solder Mask 4-Layer PCB

Blue Color Solder Mask 4-Layer PCB

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Key Specifications/Special Features:

Computer mainboard
Surface finish: HASL
Impedance tolerance: +/-10%
Minimum drilling hole size: 16mil
PTH hole diameter tolerance: 3mil
NPTH hole diameter tolerance: 2mil
Hole position deviation: ...
3.    14-Layer High Reliability PCB

14-Layer High Reliability PCB

Description

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Key Specifications/Special Features:

FR4
Surface finish: immersion gold
Board thickness: 140mil
Base copper thickness: 3oz
PTH hole diameter tolerance: 3mil
NPTH hole diameter tolerance: 2mil
Hole position deviation: 2mil
Outline ...
4.    High Density SMT 14-Layer Board

High Density SMT 14-Layer Board

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Key Specifications/Special Features:

Aspect ratio: 8:1
Minimum line width/space: 5mil
Minimum drilling hole diameter: 8mil
NPTH hole diameter tolerance: 2mil
PTH hole diameter tolerance: 3mil
Hole position deviation: 2mil
Outline ...
5.    12pcs Per Step Thin PCB

12pcs Per Step Thin PCB

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Key Specifications/Special Features:

For mobile phone camera
Bond pull force: > 8g
Gold thickness: > =5 microinches
Nickel thickness: > =150 microinches
Minimum drilling hole diameter: 8mil
Board thickness: 16mil (4 layers) ...

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