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| Model No : |
LGPP |
| Brand | LONG | | Materials | stainless and liquid silicone | | Size | 180*280 millimeters |
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LONG's thin carrier plate is a brand-new tool for dipping which can be used successfully to handle a variety of chip components such as MLCC, MLCI etc. The thin carrier plate, which is created by LONG, is designed to combine both the benefits of a traditional carrier plate and a JIG plate. Reducing the disadvantages of the competition and other conventional components.
Features:
1.Only 1.5 mm thick reducing heat absorption and cooling down in a short time.
2.Main materials are stainless and liquid silicone.
3.Reduces around 20% the tooling cost of dipping.
4.With leveling function, it results in chips with tight termination bandwidth, registration control and fine cosmetic appearance.
5.Paste does not scrape off the chip during insertion, transference, or the unloading process.
6.The shortness of the press pins can reduce their ability to crack.
7.Decreased time and labor costs due to operation ease of the light and thin carrier plate.
8.Easy to operate automatically.
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