The design of the wafer grinding machine is basically inheriting the work principle of a vertical gr->grinding machine

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Joen Lih Machinery Co., Ltd.

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The design of the wafer grinding machine is basically inheriting the work principle of a vertical gr

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Machinery on-line->Machine Tools->Grinding Machine->grinding machine

Product Specification

Model No:	JL-200SCG

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Product Detail

The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially design ed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.

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